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BibTeX records: Jeroen J. M. Zaal
@article{DBLP:journals/mr/MavinkurveMSZ16, author = {Amar Mavinkurve and Jaume L. M. Llacer Martinez and Michiel van Soestbergen and Jeroen J. M. Zaal}, title = {Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests}, journal = {Microelectron. Reliab.}, volume = {64}, pages = {254--258}, year = {2016}, url = {https://doi.org/10.1016/j.microrel.2016.07.105}, doi = {10.1016/J.MICROREL.2016.07.105}, timestamp = {Wed, 23 Mar 2022 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/MavinkurveMSZ16.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/HochstenbachDYZB10, author = {Hendrik Pieter Hochstenbach and Willem D. van Driel and Dao{-}Guo Yang and Jeroen J. M. Zaal and E. Bagerman}, title = {Designing for reliability using a new Wafer Level Package structure}, journal = {Microelectron. Reliab.}, volume = {50}, number = {4}, pages = {528--535}, year = {2010}, url = {https://doi.org/10.1016/j.microrel.2009.09.011}, doi = {10.1016/J.MICROREL.2009.09.011}, timestamp = {Sat, 22 Feb 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/HochstenbachDYZB10.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/sensors/ZaalDZ10, author = {Jeroen J. M. Zaal and Willem D. van Driel and G. Q. Zhang}, title = {Challenges in the Assembly and Handling of Thin Film Capped {MEMS} Devices}, journal = {Sensors}, volume = {10}, number = {4}, pages = {3989--4001}, year = {2010}, url = {https://doi.org/10.3390/s100403989}, doi = {10.3390/S100403989}, timestamp = {Wed, 14 Nov 2018 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/sensors/ZaalDZ10.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/ZaalHDZ09, author = {Jeroen J. M. Zaal and Hendrik Pieter Hochstenbach and Willem D. van Driel and G. Q. Zhang}, title = {Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull}, journal = {Microelectron. Reliab.}, volume = {49}, number = {8}, pages = {846--852}, year = {2009}, url = {https://doi.org/10.1016/j.microrel.2009.03.008}, doi = {10.1016/J.MICROREL.2009.03.008}, timestamp = {Sat, 22 Feb 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/ZaalHDZ09.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/ZaalDBLBZ08, author = {Jeroen J. M. Zaal and W. D. van Driel and S. Bendida and Q. Li and J. T. M. van Beek and G. Q. Zhang}, title = {Packaging influences on the reliability of {MEMS} resonators}, journal = {Microelectron. Reliab.}, volume = {48}, number = {8-9}, pages = {1567--1571}, year = {2008}, url = {https://doi.org/10.1016/j.microrel.2008.06.041}, doi = {10.1016/J.MICROREL.2008.06.041}, timestamp = {Sat, 22 Feb 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/ZaalDBLBZ08.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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