Hsiao-Tung Ku

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▷ joint publications with Chang-Chun Lee

> Home > Persons > Hsiao-Tung Ku

Publications

2007
[j1]
- view
  authority control:
- export record
  dblp key:
  - journals/mr/LeeLKCC07
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/LeeLKCC07
Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang:
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology. Microelectron. Reliab. 47(2-3): 196-204 (2007)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.