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BibTeX record conf/ats/ChenWK09
@inproceedings{DBLP:conf/ats/ChenWK09, author = {Po{-}Yuan Chen and Cheng{-}Wen Wu and Ding{-}Ming Kwai}, title = {On-Chip {TSV} Testing for 3D {IC} before Bonding Using Sense Amplification}, booktitle = {Proceedings of the Eighteentgh Asian Test Symposium, {ATS} 2009, 23-26 November 2009, Taichung, Taiwan}, pages = {450--455}, publisher = {{IEEE} Computer Society}, year = {2009}, url = {https://doi.org/10.1109/ATS.2009.42}, doi = {10.1109/ATS.2009.42}, timestamp = {Sat, 30 Sep 2023 09:34:54 +0200}, biburl = {https://dblp.org/rec/conf/ats/ChenWK09.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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