BibTeX record conf/ats/ChenWK09

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@inproceedings{DBLP:conf/ats/ChenWK09,
  author       = {Po{-}Yuan Chen and
                  Cheng{-}Wen Wu and
                  Ding{-}Ming Kwai},
  title        = {On-Chip {TSV} Testing for 3D {IC} before Bonding Using Sense Amplification},
  booktitle    = {Proceedings of the Eighteentgh Asian Test Symposium, {ATS} 2009, 23-26
                  November 2009, Taichung, Taiwan},
  pages        = {450--455},
  publisher    = {{IEEE} Computer Society},
  year         = {2009},
  url          = {https://doi.org/10.1109/ATS.2009.42},
  doi          = {10.1109/ATS.2009.42},
  timestamp    = {Sat, 30 Sep 2023 09:34:54 +0200},
  biburl       = {https://dblp.org/rec/conf/ats/ChenWK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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