BibTeX record conf/dac/DevWR13

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@inproceedings{DBLP:conf/dac/DevWR13,
  author       = {Kapil Dev and
                  Gary L. Woods and
                  Sherief Reda},
  title        = {High-throughput {TSV} testing and characterization for 3D integration
                  using thermal mapping},
  booktitle    = {The 50th Annual Design Automation Conference 2013, {DAC} '13, Austin,
                  TX, USA, May 29 - June 07, 2013},
  pages        = {73:1--73:6},
  publisher    = {{ACM}},
  year         = {2013},
  url          = {https://doi.org/10.1145/2463209.2488823},
  doi          = {10.1145/2463209.2488823},
  timestamp    = {Tue, 07 Sep 2021 19:59:27 +0200},
  biburl       = {https://dblp.org/rec/conf/dac/DevWR13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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