BibTeX record conf/icmens/NaKLKLC06

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@inproceedings{DBLP:conf/icmens/NaKLKLC06,
  author       = {Kyounghwan Na and
                  Il{-}hwan Kim and
                  Eunsung Lee and
                  Hyeon Cheol Kim and
                  Yong{-}Hwan Lee and
                  Kukjin Chun},
  title        = {Wafer Level Package Using Polymer Bonding of Thick {SU-8} Photoresist},
  booktitle    = {2006 International Conference on MEMS, {NANO} and Smart Systems, {ICMENS}
                  2006, Cairo, Egypt, December 27-29, 2006},
  pages        = {31--34},
  publisher    = {{IEEE}},
  year         = {2006},
  url          = {https://doi.org/10.1109/ICMENS.2006.348211},
  doi          = {10.1109/ICMENS.2006.348211},
  timestamp    = {Wed, 16 Oct 2019 14:14:54 +0200},
  biburl       = {https://dblp.org/rec/conf/icmens/NaKLKLC06.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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