BibTeX record conf/irps/LinO15

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@inproceedings{DBLP:conf/irps/LinO15,
  author       = {M. H. Lin and
                  A. S. Oates},
  title        = {Mechanisms of electromigration under {AC} and pulsed-DC stress in
                  Cu/low-k dual damascene interconnects},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2015, Monterey,
                  CA, USA, April 19-23, 2015},
  pages        = {2},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/IRPS.2015.7112681},
  doi          = {10.1109/IRPS.2015.7112681},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/LinO15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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