BibTeX record conf/isocc/LeeKCK16

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@inproceedings{DBLP:conf/isocc/LeeKCK16,
  author       = {Young{-}Woo Lee and
                  Junghwan Kim and
                  Inhyuk Choi and
                  Sungho Kang},
  title        = {A {TSV} test structure for simultaneously detecting resistive open
                  and bridge defects in 3D-ICs},
  booktitle    = {International SoC Design Conference, {ISOCC} 2016, Jeju, South Korea,
                  October 23-26, 2016},
  pages        = {129--130},
  publisher    = {{IEEE}},
  year         = {2016},
  url          = {https://doi.org/10.1109/ISOCC.2016.7799724},
  doi          = {10.1109/ISOCC.2016.7799724},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/isocc/LeeKCK16.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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