BibTeX record conf/isqed/ZhaoHV13

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@inproceedings{DBLP:conf/isqed/ZhaoHV13,
  author       = {Dali Zhao and
                  Houman Homayoun and
                  Alexander V. Veidenbaum},
  title        = {Temperature aware thread migration in 3D architecture with stacked
                  {DRAM}},
  booktitle    = {International Symposium on Quality Electronic Design, {ISQED} 2013,
                  Santa Clara, CA, USA, March 4-6, 2013},
  pages        = {80--87},
  publisher    = {{IEEE}},
  year         = {2013},
  url          = {https://doi.org/10.1109/ISQED.2013.6523594},
  doi          = {10.1109/ISQED.2013.6523594},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/isqed/ZhaoHV13.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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