BibTeX record journals/mr/DanduFLD10

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@article{DBLP:journals/mr/DanduFLD10,
  author       = {Pridhvi Dandu and
                  Xuejun Fan and
                  Y. Liu and
                  C. Diao},
  title        = {Finite element modeling on electromigration of solder joints in wafer
                  level packages},
  journal      = {Microelectron. Reliab.},
  volume       = {50},
  number       = {4},
  pages        = {547--555},
  year         = {2010},
  url          = {https://doi.org/10.1016/j.microrel.2009.12.003},
  doi          = {10.1016/J.MICROREL.2009.12.003},
  timestamp    = {Thu, 23 Jun 2022 20:05:03 +0200},
  biburl       = {https://dblp.org/rec/journals/mr/DanduFLD10.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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