BibTeX record journals/mr/Hammad18

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@article{DBLP:journals/mr/Hammad18,
  author       = {A. E. Hammad},
  title        = {Enhancing the ductility and mechanical behavior of Sn-1.0Ag-0.5Cu
                  lead-free solder by adding trace amount of elements Ni and Sb},
  journal      = {Microelectron. Reliab.},
  volume       = {87},
  pages        = {133--141},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2018.06.015},
  doi          = {10.1016/J.MICROREL.2018.06.015},
  timestamp    = {Mon, 26 Oct 2020 08:59:30 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/Hammad18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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