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BibTeX record journals/mr/KimRYK05
@article{DBLP:journals/mr/KimRYK05, author = {Kyung{-}Seob Kim and K. W. Ryu and C. H. Yu and J. M. Kim}, title = {The formation and growth of intermetallic compounds and shear strength at Sn-Zn solder/Au-Ni-Cu interfaces}, journal = {Microelectron. Reliab.}, volume = {45}, number = {3-4}, pages = {647--655}, year = {2005}, url = {https://doi.org/10.1016/j.microrel.2004.07.005}, doi = {10.1016/J.MICROREL.2004.07.005}, timestamp = {Thu, 31 Aug 2023 16:23:36 +0200}, biburl = {https://dblp.org/rec/journals/mr/KimRYK05.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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