BibTeX record journals/mr/LiDMLWH11

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@article{DBLP:journals/mr/LiDMLWH11,
  author       = {Junhui Li and
                  Luhua Deng and
                  Bangke Ma and
                  Ling gang Liu and
                  Fuliang Wang and
                  Lei Han},
  title        = {Investigation of the characteristics of overhang bonding for 3-D stacked
                  dies in microelectronics packaging},
  journal      = {Microelectron. Reliab.},
  volume       = {51},
  number       = {12},
  pages        = {2236--2242},
  year         = {2011},
  url          = {https://doi.org/10.1016/j.microrel.2011.06.005},
  doi          = {10.1016/J.MICROREL.2011.06.005},
  timestamp    = {Sat, 22 Feb 2020 19:27:12 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/LiDMLWH11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
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