BibTeX record journals/mr/SuCLCLCT18

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@article{DBLP:journals/mr/SuCLCLCT18,
  author       = {Meiying Su and
                  Liqiang Cao and
                  Tingyu Lin and
                  Feng Chen and
                  Jun Li and
                  Cheng Chen and
                  Gengxin Tian},
  title        = {Warpage simulation and experimental verification for 320{\unicode{8239}}mm{\unicode{8239}}{\texttimes}{\unicode{8239}}320{\unicode{8239}}mm
                  panel level fan-out packaging based on die-first process},
  journal      = {Microelectron. Reliab.},
  volume       = {83},
  pages        = {29--38},
  year         = {2018},
  url          = {https://doi.org/10.1016/j.microrel.2018.02.010},
  doi          = {10.1016/J.MICROREL.2018.02.010},
  timestamp    = {Thu, 14 Dec 2023 08:23:55 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/SuCLCLCT18.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}