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BibTeX record journals/tcad/DingCM18
@article{DBLP:journals/tcad/DingCM18, author = {Yixiao Ding and Chris Chu and Wai{-}Kei Mak}, title = {Self-Aligned Double Patterning-Aware Detailed Routing With Double Via Insertion and Via Manufacturability Consideration}, journal = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.}, volume = {37}, number = {3}, pages = {657--668}, year = {2018}, url = {https://doi.org/10.1109/TCAD.2017.2712660}, doi = {10.1109/TCAD.2017.2712660}, timestamp = {Thu, 24 Sep 2020 11:26:39 +0200}, biburl = {https://dblp.org/rec/journals/tcad/DingCM18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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