BibTeX record journals/tcad/YangGZDS07

download as .bib file

@article{DBLP:journals/tcad/YangGZDS07,
  author       = {Yonghong Yang and
                  Zhenyu (Peter) Gu and
                  Changyun Zhu and
                  Robert P. Dick and
                  Li Shang},
  title        = {{ISAC:} Integrated Space-and-Time-Adaptive Chip-Package Thermal Analysis},
  journal      = {{IEEE} Trans. Comput. Aided Des. Integr. Circuits Syst.},
  volume       = {26},
  number       = {1},
  pages        = {86--99},
  year         = {2007},
  url          = {https://doi.org/10.1109/TCAD.2006.882589},
  doi          = {10.1109/TCAD.2006.882589},
  timestamp    = {Thu, 24 Sep 2020 11:27:23 +0200},
  biburl       = {https://dblp.org/rec/journals/tcad/YangGZDS07.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}
a service of  Schloss Dagstuhl - Leibniz Center for Informatics