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@article{DBLP:journals/mr/ChoiYAKBK18, author = {Kyeonggon Choi and Dong{-}Youl Yu and Sungdo Ahn and Kyoung{-}Ho Kim and Jung{-}Hwan Bang and Yong{-}Ho Ko}, title = {Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {66--71}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.05.006}, doi = {10.1016/J.MICROREL.2018.05.006}, timestamp = {Sat, 22 Feb 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/ChoiYAKBK18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/HaniniA18, author = {Wasma Hanini and Moez Ayadi}, title = {Electro thermal modeling of the power diode using Pspice}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {82--91}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.05.008}, doi = {10.1016/J.MICROREL.2018.05.008}, timestamp = {Sat, 22 Feb 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/HaniniA18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/JanickiTSRN18, author = {Marcin Janicki and Tomasz Torzewicz and Agnieszka Samson and Tomasz Raszkowski and Andrzej Napieralski}, title = {Experimental identification of {LED} compact thermal model element values}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {20--26}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.05.003}, doi = {10.1016/J.MICROREL.2018.05.003}, timestamp = {Fri, 09 Apr 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/journals/mr/JanickiTSRN18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/KristofikBM18, author = {Stefan Kristof{\'{\i}}k and Marcel Bal{\'{a}}z and Peter Mal{\'{\i}}k}, title = {Hardware redundancy architecture based on reconfigurable logic blocks with persistent high reliability improvement}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {38--53}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.04.010}, doi = {10.1016/J.MICROREL.2018.04.010}, timestamp = {Sun, 02 Oct 2022 01:00:00 +0200}, biburl = {https://dblp.org/rec/journals/mr/KristofikBM18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/LiLZPWY18, author = {Ting Li and Zebin Li and Ke Zhao and Boan Pan and Zhiyuan Wang and Xiping Yang}, title = {Reliability analysis of a mini-instrument for simultaneous monitoring water content, deep tissue temperature, and hemodynamic parameters}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {72--76}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.05.009}, doi = {10.1016/J.MICROREL.2018.05.009}, timestamp = {Thu, 22 Oct 2020 01:00:00 +0200}, biburl = {https://dblp.org/rec/journals/mr/LiLZPWY18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/MartinezAREO18, author = {Jorge Mart{\'{\i}}nez and Mert Atamaner and Pedro Reviriego and Oguz Ergin and Marco Ottavi}, title = {Opcode vector: An efficient scheme to detect soft errors in instructions}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {92--97}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.03.017}, doi = {10.1016/J.MICROREL.2018.03.017}, timestamp = {Thu, 17 Mar 2022 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/MartinezAREO18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/MikkonenM18, author = {Riikka Mikkonen and Matti M{\"{a}}ntysalo}, title = {Evaluation of screen printed silver trace performance and long-term reliability against environmental stress on a low surface energy substrate}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {54--65}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.05.010}, doi = {10.1016/J.MICROREL.2018.05.010}, timestamp = {Fri, 09 Apr 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/journals/mr/MikkonenM18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/NguyenDNTDPN18, author = {Nam Nguyen and Van{-}Quyen Dinh and Tung Nguyen{-}Duc and Quoc{-}Tuan Ta and Xuan{-}Viet Dao and Thanh{-}Huy Pham and Trung{-}Kien Nguyen{-}Duc}, title = {Effect of potting materials on {LED} bulb's driver temperature}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {77--81}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.05.012}, doi = {10.1016/J.MICROREL.2018.05.012}, timestamp = {Thu, 14 Oct 2021 01:00:00 +0200}, biburl = {https://dblp.org/rec/journals/mr/NguyenDNTDPN18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/RaszkowskiSZ18, author = {Tomasz Raszkowski and Agnieszka Samson and Mariusz Zubert}, title = {Influence of temperature and heat flux time lags on the temperature distribution in modern {GAAFET} structure based on Dual-Phase-Lag thermal model}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {10--19}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.05.004}, doi = {10.1016/J.MICROREL.2018.05.004}, timestamp = {Sat, 22 Feb 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/RaszkowskiSZ18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/WanLHQXLJ18, author = {Yongqiang Wan and Shuang Li and Xiaowu Hu and Yu Qiu and Tao Xu and Yulong Li and Xiongxin Jiang}, title = {Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {27--37}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.05.007}, doi = {10.1016/J.MICROREL.2018.05.007}, timestamp = {Sat, 22 Feb 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/WanLHQXLJ18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
@article{DBLP:journals/mr/WlanisHELSGRM18, author = {Thomas Wlanis and Ren{\'{e}} Hammer and Werner Ecker and Sandrine Lhostis and Cl{\'{e}}ment Sart and S{\'{e}}bastien Gallois{-}Garreignot and Bernhard Rebhan and G{\"{u}}nther A. Maier}, title = {Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: {A} critical comparison of 2D and 3D modeling approach}, journal = {Microelectron. Reliab.}, volume = {86}, pages = {1--9}, year = {2018}, url = {https://doi.org/10.1016/j.microrel.2018.05.005}, doi = {10.1016/J.MICROREL.2018.05.005}, timestamp = {Mon, 26 Oct 2020 00:00:00 +0100}, biburl = {https://dblp.org/rec/journals/mr/WlanisHELSGRM18.bib}, bibsource = {dblp computer science bibliography, https://dblp.org} }
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