23rd Asian Test Symposium 2014: Hangzhou, China

Session 1A: 3D Testing

Session 1B: Reliability

Special Session 1C: Resilient Circuit Design and Test

Session 2A: Testing of Emerging Technologies

Session 2B: SoC Testing

Session 3A: Post-silicon Validation

Session 3B: Testability and Test Generation

Session 4A: Yield Optimization of Memory

Session 4B: On-Line Parameter Testing

Session 5A: Power/Temperature-Aware Testing

Session 5B: Trojan/Fault Detection with High Resolution

Session 6A: Analog/Memory Testing

Panel Session 6B: Big Data for Test

Special Session 6C: In-Field Techniques for Performance Adaption, Test, and Power-Noise Diagnosis

Session 7A: Timing Variation Detection

Session 7B: Delay Testing

Special Session 7C: High Quality System Level Test and Diagnosis

Session 8A: Diagnosis

Session 8B: Test Compression

Special Session 8C: Hardware Security

a service of Schloss Dagstuhl - Leibniz Center for Informatics