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International Workshop on Emergency Management using GIS (EM-GIS)
EM-GIS 2023: Hamburg, Germany
- Yan Huang, Jean-Claude Thill, Hui Zhang, Danhuai Guo, Yi Liu, Wei Xu, Bin Chen:

Proceedings of the 8th ACM SIGSPATIAL International Workshop on Security Response using GIS 2023, EM-GIS 2023, Hamburg, Germany, 13 November 2023. ACM 2023 [contents]
EM-GIS 2021: Beijing, China
- EM-GIS '21: Proceedings of the 7th ACM SIGSPATIAL International Workshop on Emergency Management using GIS, Beijing, China, 3 November 2021. ACM 2021, ISBN 978-1-4503-9099-6 [contents]

EM-GIS 2020: Seattle, WA, USA
- Yan Huang, Jean-Claude Thill, Hui Zhang:

EM-GIS '20: Proceedings of the 6th ACM SIGSPATIAL International Workshop on Emergency Management using GIS, Seattle, Washington, USA, November 3, 2020. ACM 2020, ISBN 978-1-4503-8159-8 [contents]
EM-GIS 2019: Chicago, IL, USA
- EM-GIS '19: Proceedings of the 5th ACM SIGSPATIAL International Workshop on the Use of GIS in Emergency Management Chicago, Illinois, USA, November, 2019. ACM 2019, ISBN 978-1-4503-6965-7 [contents]

EM-GIS 2018: Seattle, WA, USA
- Proceedings of the 4th ACM SIGSPATIAL International Workshop on Safety and Resilience, EM-GIS@SIGSPATIAL 2018, Seattle, WA, USA, November 06-09, 2018. ACM 2018, ISBN 978-1-4503-6044-9 [contents]

EM-GIS 2017: Redondo Beach, CA, USA
- Yan Huang, Jean-Claude Thill, Hui Zhang:

Proceedings of the 3rd ACM SIGSPATIAL Workshop on Emergency Management using, Redondo Beach, CA, USA, November 07 - 10, 2017. ACM 2017, ISBN 978-1-4503-5493-6 [contents]
EM-GIS 2016: Burlingame, CA, USA
- Hui Zhang, Yan Huang, Jean-Claude Thill:

Proceedings of the Second ACM SIGSPATIAL International Workshop on the Use of GIS in Emergency Management, EM-GIS 2016, Burlingame, CA, USA, October 31 - November 3, 2016. ACM 2016, ISBN 978-1-4503-4580-4 [contents]
EM-GIS 2015: Bellevue, WA, USA
- Yan Huang, Jean-Claude Thill, Hui Zhang:

Proceedings of the 1st ACM SIGSPATIAL International Workshop on the Use of GIS in Emergency Management, EM-GIS 2015, Bellevue, Washington, USA, November 3-6, 2015. ACM 2015, ISBN 978-1-4503-3970-4 [contents]

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