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ORCIDMicroelectronics Reliability, Volume 62
Volume 62, July 2016
- Artur Wymyslowski:
Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. 1-3 - Pradeep Lall, Di Zhang, Vikas Yadav, David Locker:
High strain rate constitutive behavior of SAC105 and SAC305 leadfree solder during operation at high temperature. 4-17 - Emad A. Poshtan, Sven Rzepka
, Christian Silber, Bernhard Wunderle:
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages. 18-25 - A. R. Rezaie Adli, Kaspar M. B. Jansen:
Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging. 26-38 - W. D. van Driel, M. Schuld, B. Jacobs, F. Commissaris, J. van der Eyden, B. Hamon:
Lumen maintenance predictions for LED packages. 39-44 - Marco Barink, A. Mavinkurve, J. Janssen:
Predicting non-Fickian moisture diffusion in EMCs for application in micro-electronic devices. 45-49 - Alexander W. J. Gielen, F. O. Valega Mackenzie:
Thermo-mechanical effects in Majorana type quantum devices. 50-57 - Alicja Palczynska, Przemyslaw Jakub Gromala, Dirk Mayer, Bongtae Han, Tobias Melz:
In-situ investigation of EMC relaxation behavior using piezoresistive stress sensor. 58-62
- Erjuan Guo, Zhigang Zeng, Yan Zhang, Xiao Long, Haijun Zhou, Xiaohong Wang:
The effect of annealing temperature on the electronic parameters and carrier transport mechanism of Pt/n-type Ge Schottky diode. 63-69 - Weichun Luo, Hong Yang, Wenwu Wang, Yefeng Xu, Bo Tang, Shangqing Ren, Hao Xu, Yanrong Wang, Luwei Qi, Jiang Yan, Huilong Zhu, Chao Zhao, Dapeng Chen, Tianchun Ye:
Accurate lifetime prediction for channel hot carrier stress on sub-1 nm equivalent oxide thickness HK/MG nMOSFET with thin titanium nitride capping layer. 70-73 - M. Baghaie Yazdi, M. Schmeidl, X. Wu, T. Neyer:
A concise study of neutron irradiation effects on power MOSFETs and IGBTs. 74-78 - Wangran Wu, J. Lu, Chang Liu, Heng Wu, Xiaoyu Tang, Jiabao Sun, Rui Zhang, Wenjie Yu, Xi Wang, Yi Zhao:
Gate length dependence of bias temperature instability behavior in short channel SOI MOSFETs. 79-81 - Canras Batunlu, Al-Hussein Albarbar:
Real-time system for monitoring the electro-thermal behaviour of power electronic devices used in boost converters. 82-90 - R. Sajedi, B. Osanloo, Faramarz Talati, Mohammad Taghilou:
Splitter plate application on the circular and square pin fin heat sinks. 91-101 - Améni Driss, Samah Maalej, Mohamed Chaker Zaghdoudi:
Experimentation and modeling of the steady-state and transient thermal performances of a helicoidally grooved cylindrical heat pipe. 102-112 - Michael G. Pecht, Tadahiro Shibutani, Lifeng Wu:
A reliability assessment guide for the transition planning to lead-free electronics for companies whose products are RoHS exempted or excluded. 113-123 - Nick Bosco, Timothy J. Silverman, Sarah Kurtz:
Climate specific thermomechanical fatigue of flat plate photovoltaic module solder joints. 124-129 - Chaoran Yang, Fuliang Le, S. W. Ricky Lee:
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints. 130-140 - Heng Li, Chunsheng Zhu, Gaowei Xu, Le Luo:
Experimental identification of thermal induced warpage in polymer-metal composite films. 141-147 - Klaus Fellner, Thomas Antretter, Peter Filipp Fuchs, Qi Tao:
Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads. 148-155 - Ragh Kuttappa, Houman Homayoun, Hassan Salmani, Hamid Mahmoodi:
Reliability analysis of spin transfer torque based look up tables under process variations and NBTI aging. 156-166 - Yuanyuan Jiang, Youren Wang, Yi Wu, Quan Sun:
Fault prognostic of electronics based on optimal multi-order particle filter. 167-177 - Alireza Tajary, Hamid R. Zarandi:
Using instruction result locality and re-execution to mitigate silent data corruptions. 178-190
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