BibTeX records: Henrik Hovsepyan

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@inproceedings{DBLP:conf/irps/KteyanHCS19,
  author       = {Armen Kteyan and
                  Henrik Hovsepyan and
                  Jun{-}Ho Choy and
                  Valeriy Sukharev},
  title        = {Assesment of {CPI} Stress Impact on {IC} Reliability and Performance
                  in 2.5D/3D Packages},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2019, Monterey,
                  CA, USA, March 31 - April 4, 2019},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2019},
  url          = {https://doi.org/10.1109/IRPS.2019.8720471},
  doi          = {10.1109/IRPS.2019.8720471},
  timestamp    = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/KteyanHCS19.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/islped/ChoySKHVC15,
  author       = {Jun{-}Ho Choy and
                  Valeriy Sukharev and
                  Armen Kteyan and
                  Henrik Hovsepyan and
                  Ramnath Venkatraman and
                  Ruggero Castagnetti},
  title        = {Post placement leakage reduction with stress-enhanced filler cells},
  booktitle    = {{IEEE/ACM} International Symposium on Low Power Electronics and Design,
                  {ISLPED} 2015, Rome, Italy, July 22-24, 2015},
  pages        = {303--308},
  publisher    = {{IEEE}},
  year         = {2015},
  url          = {https://doi.org/10.1109/ISLPED.2015.7273531},
  doi          = {10.1109/ISLPED.2015.7273531},
  timestamp    = {Wed, 16 Oct 2019 14:14:56 +0200},
  biburl       = {https://dblp.org/rec/conf/islped/ChoySKHVC15.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@article{DBLP:journals/et/SukharevKCHMZH12,
  author       = {Valeriy Sukharev and
                  Armen Kteyan and
                  Jun{-}Ho Choy and
                  Henrik Hovsepyan and
                  Ara Markosian and
                  Ehrenfried Zschech and
                  Rene Huebner},
  title        = {Multi-scale Simulation Methodology for Stress Assessment in 3D {IC:}
                  Effect of Die Stacking on Device Performance},
  journal      = {J. Electron. Test.},
  volume       = {28},
  number       = {1},
  pages        = {63--72},
  year         = {2012},
  url          = {https://doi.org/10.1007/s10836-011-5259-y},
  doi          = {10.1007/S10836-011-5259-Y},
  timestamp    = {Fri, 11 Sep 2020 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/journals/et/SukharevKCHMZH12.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/isqed/SukharevMKMKCLHOKK09,
  author       = {Valeriy Sukharev and
                  Ara Markosian and
                  Armen Kteyan and
                  Levon Manukyan and
                  Nikolay Khachatryan and
                  Jun{-}Ho Choy and
                  Hasmik Lazaryan and
                  Henrik Hovsepyan and
                  Seiji Onoue and
                  Takuo Kikuchi and
                  Tetsuya Kamigaki},
  title        = {Control of design specific variation in etch-assisted via pattern
                  transfer by means of full-chip simulation},
  booktitle    = {10th International Symposium on Quality of Electronic Design {(ISQED}
                  2009), 16-18 March 2009, San Jose, CA, {USA}},
  pages        = {156--161},
  publisher    = {{IEEE} Computer Society},
  year         = {2009},
  url          = {https://doi.org/10.1109/ISQED.2009.4810286},
  doi          = {10.1109/ISQED.2009.4810286},
  timestamp    = {Thu, 23 Mar 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/isqed/SukharevMKMKCLHOKK09.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}