BibTeX records: S. Pae

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@inproceedings{DBLP:conf/irps/HaLBLKWLLP23,
  author       = {Sungmock Ha and
                  S. Lee and
                  G. H. Bae and
                  D. S. Lee and
                  S. H. Kim and
                  B. W. Woo and
                  N.{-}H. Lee and
                  Y. S. Lee and
                  S. Pae},
  title        = {Reliability Characterization of {HBM} featuring {\textdollar}{\textbackslash}text\{HK\}+{\textbackslash}text\{MG\}{\textdollar}
                  Logic Chip with Multi-stacked DRAMs},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2023, Monterey,
                  CA, USA, March 26-30, 2023},
  pages        = {1--7},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/IRPS48203.2023.10118277},
  doi          = {10.1109/IRPS48203.2023.10118277},
  timestamp    = {Wed, 24 May 2023 09:43:44 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/HaLBLKWLLP23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/irps/LeeLLKJLHKP23,
  author       = {S. Lee and
                  N.{-}H. Lee and
                  K. W. Lee and
                  J. H. Kim and
                  J. H. Jin and
                  Y. S. Lee and
                  Y. C. Hwang and
                  H. S. Kim and
                  S. Pae},
  title        = {Development and Product Reliability Characterization of Advanced High
                  Speed 14nm {DDR5} {DRAM} with On-die {ECC}},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2023, Monterey,
                  CA, USA, March 26-30, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/IRPS48203.2023.10117889},
  doi          = {10.1109/IRPS48203.2023.10117889},
  timestamp    = {Wed, 24 May 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/LeeLLKJLHKP23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/irps/LeeWLLLLKP23,
  author       = {J. H. Lee and
                  B. W. Woo and
                  Y. M. Lee and
                  N. H. Lee and
                  S. H. Lee and
                  Y. S. Lee and
                  H. S. Kim and
                  S. Pae},
  title        = {Reliability Improvement with Optimized {BEOL} Process in Advanced
                  {DRAM}},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2023, Monterey,
                  CA, USA, March 26-30, 2023},
  pages        = {1--4},
  publisher    = {{IEEE}},
  year         = {2023},
  url          = {https://doi.org/10.1109/IRPS48203.2023.10118168},
  doi          = {10.1109/IRPS48203.2023.10118168},
  timestamp    = {Wed, 24 May 2023 01:00:00 +0200},
  biburl       = {https://dblp.org/rec/conf/irps/LeeWLLLLKP23.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

@inproceedings{DBLP:conf/irps/LeeLKKLLHKP22,
  author       = {Nam{-}Hyun Lee and
                  S. Lee and
                  S.{-}H. Kim and
                  G.{-}J. Kim and
                  K. W. Lee and
                  Y. S. Lee and
                  Y. C. Hwang and
                  H. S. Kim and
                  S. Pae},
  title        = {Transistor Reliability Characterization for Advanced {DRAM} with {HK+MG}
                  {\&} {EUV} process technology},
  booktitle    = {{IEEE} International Reliability Physics Symposium, {IRPS} 2022, Dallas,
                  TX, USA, March 27-31, 2022},
  pages        = {6},
  publisher    = {{IEEE}},
  year         = {2022},
  url          = {https://doi.org/10.1109/IRPS48227.2022.9764439},
  doi          = {10.1109/IRPS48227.2022.9764439},
  timestamp    = {Thu, 02 Feb 2023 00:00:00 +0100},
  biburl       = {https://dblp.org/rec/conf/irps/LeeLKKLLHKP22.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}