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Flynn Carson

Flynn P. Carson

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2000 – 2009

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2009
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Flynn P. Carson, Young Cheol Kim, In Sang Yoon:
3-D Stacked Package Technology and Trends. Proc. IEEE 97(1): 31-42 (2009)
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Seung Wook Yoon, Jae Hoon Ku, Nathapong Suthiwongsunthorn, Pandi Chelvam Marimuthu, Flynn Carson:
Fabrication and packaging of microbump interconnections for 3D TSV. 3DIC 2009: 1-5
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Seung Wook Yoon, Dae Wook Yang, Jae Hoon Koo, Meenakshi Padmanathan, Flynn Carson:
3D TSV processes and its assembly/packaging technology. 3DIC 2009: 1-5

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