Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

Daniel H. Jung

> Home > Persons

Person information

affiliation: Korea Advanced Institute of Science and Technology, Daejeon, South Korea

Refine list

refinements active!

zoomed in on ?? of ?? records

view refined list in

export refined list as

showing all ?? records

2010 – 2019

see FAQ

What is the meaning of the colors in the publication lists?

2016
[j1]
- view
  authority control:
- export record
  dblp key:
  - journals/dt/LeeJKCK16
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/dt/LeeJKCK16
Manho Lee, Daniel H. Jung, Heegon Kim, Jonghyun Cho, Joungho Kim:
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs. IEEE Des. Test 33(2): 17-29 (2016)
2015
[c12]
- view
  authority control:
- export record
  dblp key:
  - conf/3dic/ChoiKJKLLCKKKK15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/ChoiKJKLLCKKKK15
Sumin Choi, Heegon Kim, Daniel H. Jung, Jonghoon J. Kim, Jaemin Lim, Hyunsuk Lee, Kyungjun Cho, Joungho Kim, Hyungsoo Kim, Yong-Ju Kim, Yunsaing Kim:
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC. 3DIC 2015: TS8.25.1-TS8.25.5
[c11]
- view
  authority control:
- export record
  dblp key:
  - conf/3dic/JungKKKKBC15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/JungKKKKBC15
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation. 3DIC 2015: TS8.29.1-TS8.29.4
[c10]
- view
  authority control:
- export record
  dblp key:
  - conf/emccompo/KimJKKCLK15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/emccompo/KimJKKCLK15
Jonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim:
TSV-based current probing structure using magnetic coupling in 2.5D and 3D IC. EMC Compo 2015: 212-215
[c9]
- view
  authority control:
- export record
  dblp key:
  - conf/emccompo/LimLJKCLK15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/emccompo/LimLJKCLK15
Jaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim:
Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D IC. EMC Compo 2015: 248-251
2014
[c8]
- view
  authority control:
- export record
  dblp key:
  - conf/3dic/JungKKKKBC14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/JungKKKKBC14
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Fault detection and isolation of multiple defects in through silicon via (TSV) channel. 3DIC 2014: 1-5
[c7]
- view
  authority control:
- export record
  dblp key:
  - conf/3dic/KimBKKKJK14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/KimBKKKJK14
Jonghoon J. Kim, Bumhee Bae, Sukjin Kim, Sunkyu Kong, Heegon Kim, Daniel H. Jung, Joungho Kim:
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. 3DIC 2014: 1-6
2013
[c6]
- view
  authority control:
- export record
  dblp key:
  - conf/3dic/JungCKKKKBC13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/JungCKKKKBC13
Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Fault isolation of short defect in through silicon via (TSV) based 3D-IC. 3DIC 2013: 1-4
[c5]
- view
  authority control:
- export record
  dblp key:
  - conf/3dic/KimCKJCKLP13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/KimCKJCKLP13
Heegon Kim, Jonghyun Cho, Jonghoon J. Kim, Daniel H. Jung, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Eye-diagram simulation and analysis of a high-speed TSV-based channel. 3DIC 2013: 1-7
[c4]
- view
  authority control:
- export record
  dblp key:
  - conf/3dic/KimKKBJKKLP13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/KimKKBJKKLP13
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park:
Non-contact wafer-level TSV connectivity test methodology using magnetic coupling. 3DIC 2013: 1-4
[c3]
- view
  authority control:
- export record
  dblp key:
  - conf/emccompo/KimCJKCKLP13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/emccompo/KimCJKCKLP13
Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. EMC Compo 2013: 5-9
[c2]
- view
  authority control:
- export record
  dblp key:
  - conf/emccompo/KimKKBJKKLP13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/emccompo/KimKKBJKKLP13
Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park:
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. EMC Compo 2013: 158-162
[c1]
- view
  authority control:
- export record
  dblp key:
  - conf/emccompo/JungKKKBC13
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/emccompo/JungKKKBC13
Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of open defect in through silicon via (TSV) channel. EMC Compo 2013: 163-166

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.