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ORCIDKenneth J. Rebibis
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- affiliation: IMEC, Leuven, Belgium
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2010 – 2019
- 2019
[c6]Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne
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Process Complexity and Cost Considerations of Multi-Layer Die Stacks. 3DIC 2019: 1-6- 2016
- [c5]Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller:
Die to wafer 3D stacking for below 10um pitch microbumps. 3DIC 2016: 1-4 - [c4]Anne Jourdain, Joeri De Vos, Fumihiro Inoue, Kenneth J. Rebibis, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Janet Hopkins, Huma Ashraf, Dave Thomas:
Extreme wafer thinning optimization for via-last applications. 3DIC 2016: 1-5 - 2012
- [c3]Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen:
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4 - 2011
- [c2]Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu:
3D stacking using Cu-Cu direct bonding. 3DIC 2011: 1-4 - [c1]Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, Wenqi Zhang, Eric Beyne:
3D stacking using ultra thin dies. 3DIC 2011: 1-5
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