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ORCIDKun Wang 0018
Person information
- affiliation: Donghua University, Shanghai, China
- affiliation: Hunan Institute of Engineering, College of Textile & Fashion, Xiangtan, China
Other persons with the same name
- Kun Wang — disambiguation page
- Kun Wang 0001 — Xidian University, School of Computer Science, Xi'an, China
- Kun Wang 0002
![[0000-0003-4128-1112]](https://dblp.dagstuhl.de/img/orcid-mark.12x12.png "0000-0003-4128-1112")
— Acreo Swedish ICT AB, Department of NetLab, Kista, Sweden - Kun Wang 0003 — University of California at Davis, Department of Electrical and Computer Engineering, CA, USA
- Kun Wang 0004 — Illinois Institute of Technology, Department of Biomedical Engineering, Chicago, IL, USA
- Kun Wang 0005 — University of California at Los Angeles, CA, USA (and 5 more)
- Kun Wang 0006 — Tongji University, Shanghai, Department of Mechanical Engineering, China
- Kun Wang 0007 — National Computer Network Emergency Response Technical Team/Coordination Center of China, Beijing, China (and 1 more)
- Kun Wang 0008 — University of Science and Technology of China, Optical Wireless Communication and Network Center, Hefei, China
- Kun Wang 0009 — Ocean University of China, College of Engineering, Qingdao, China (and 1 more)
- Kun Wang 0010 — South China University of Technology, School of Electronics and Information Engineering, WuShan, China
- Kun Wang 0011 — Northwestern Polytechnical University, Department of Communications Engineering, State-and-Provincial Joint Laboratory of Internet-of-Things Technologies and Applications, Xi'an, China
- Kun Wang 0012 — Beijing University of Aeronautics and Astronautics, School of Instrumentation Science and Optoelectronics Engineering, Beijing, China (and 1 more)
- Kun Wang 0013 — Dalian University of Technology, School of Software, China
- Kun Wang 0014 — Zhejiang University, College of Electrical Engineering, Hangzhou, China
- Kun Wang 0015 — Arizona State University, Tempe, USA
- Kun Wang 0016 — Chinese Academy of Science, Institute of Plasma Physics, Hefei, China
- Kun Wang 0017 — Jilin University, College of Geo-Exploration Science and Technology, Changchun, China
- Kun Wang 0019 — Chinese Academy of Sciences, Key Laboratory of Molecular Imaging and Functional Imaging, Institute of Automation, Beijing, China
- Kun Wang 0020 — Google, Pittsburgh, PA, USA (and 1 more)
- Kun Wang 0021 — Chongqing University, School of Big Data and Software Engineering, China
- Kun Wang 0022 — University of Calgary, Department of Chemical and Petroleum Engineering, AB, Canada (and 1 more)
- Kun Wang 0023 — Zhejiang University, China
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2010 – 2019
- 2019
[j1]Kun Wang, Wei Wang, Xiong Yan:
Effect of hole on sound absorption coefficient of micro-perforated panels investigated by Melling computing. Concurr. Comput. Pract. Exp. 31(12) (2019)
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