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D. Q. Yu

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2010 – 2019

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2010
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Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu:
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. Microelectron. Reliab. 50(9-11): 1336-1340 (2010)

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