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Lei Peng 0003

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affiliation: ShanghaiTech University, School of Information Science and Technology, China
affiliation: Michigan State University, Department of Electrical and Computational Engineering, East Lansing, MI, USA
affiliation: Chinese Academy of Sciences, Shanghai Institute of Microsystem and Information Technology, China
affiliation: University of Chinese Academy of Sciences, Beijing, China
affiliation (former): Hefei University of Technology, Hefei, China

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2020 – today

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2022
[j5]
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Chaofeng Ye, Na Zhang, Lei Peng, Yu Tao:
Flexible Array Probe With In-Plane Differential Multichannels for Inspection of Microdefects on Curved Surface. IEEE Trans. Ind. Electron. 69(1): 900-910 (2022)
[j4]
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Na Zhang, Lei Peng, Yunze He, Chaofeng Ye:
Flexible Probe With Array Tunneling Magnetoresistance Sensors for Curved Structure Inspection. IEEE Trans. Instrum. Meas. 71: 1-9 (2022)
2021
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Na Zhang, Chaofeng Ye, Lei Peng, Yu Tao:
Eddy Current Probe With Three-Phase Excitation and Integrated Array Tunnel Magnetoresistance Sensors. IEEE Trans. Ind. Electron. 68(6): 5325-5336 (2021)
[j2]
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Lei Peng, Na Zhang, Yu Tao, Chaofeng Ye:
Fastener Tilt Assessment Based on Magnetic Field Image Obtained With Array Tunnel Magnetoresistance Sensors. IEEE Trans. Instrum. Meas. 70: 1-9 (2021)
[j1]
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Xinchen Tao, Lei Peng, Yu Tao, Chaofeng Ye:
Inspection of Defects in Weld Using Differential Array ECT Probe and Deep Learning Algorithm. IEEE Trans. Instrum. Meas. 70: 1-9 (2021)
[c1]
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Na Zhang, Chaofeng Ye, Xinchen Tao, Lei Peng, Yu Tao, Ming Li:
Flexible PCB with Differential Array Coils for Irregular Shape Inspection. ISIE 2021: 1-6

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