Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests.

Mon, 01 Jan 2007 00:00:00 +0100

Tomi Laurila , Toni T. Mattila, Vesa Vuorinen , Juha Karppinen, Jue Li, Mika Sippola, Jorma K. Kivilahti:
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. Microelectron. Reliab. 47(7): 1135-1144 (2007)