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Xiangkun Yin
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2020 – today
- 2024
- [j16]Fengjuan Wang, Jilin Kou, Xiangkun Yin
, Jiangfan Liu, Kai Jing, Ningmei Yu, Yuan Yang, Qian Li:
A compact fifth-order SIW BPF based on TSV technology with high selectivity. Microelectron. J. 144: 106067 (2024) - 2023
- [j15]Fengjuan Wang, Zhuoyu Yang, Xiangkun Yin, Ningmei Yu, Yuan Yang:
TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications. IEICE Electron. Express 20(10): 20230116 (2023) - [j14]Fengjuan Wang, Ying Lu, Xiangkun Yin
, Jiangfan Liu, Ningmei Yu, Yuan Yang:
Miniaturized silicon-based substrate integrated waveguide filter for 6G applications. Microelectron. J. 138: 105837 (2023) - 2022
- [j13]Fengjuan Wang, Sa Xiao, Xiangkun Yin, Ningmei Yu, Yuan Yang:
A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line. IEICE Electron. Express 19(3): 20210515 (2022) - [j12]Xiangkun Yin, Jingyu Lu, Fengjuan Wang:
Wideband transmission optimization for heterogenous interconnection in 3D IC. IEICE Electron. Express 19(5): 20210559 (2022) - [j11]Xiangkun Yin, Jingyu Lu, Fengjuan Wang
:
Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application. Microelectron. J. 119: 105317 (2022) - [j10]Fengjuan Wang
, Ruiqi Li, Xiangkun Yin
, Ningmei Yu, Yuan Yang:
Compact high-performance dual-frequency power divider based on TSV. Microelectron. J. 129: 105580 (2022) - [j9]Fengjuan Wang
, Kai Zhang, Xiangkun Yin
, Ningmei Yu, Yuan Yang
:
A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application. IEEE Trans. Very Large Scale Integr. Syst. 30(7): 989-992 (2022) - 2021
- [j8]Fengjuan Wang
, Lei Ke, Xiangkun Yin
, Ningmei Yu, Yuan Yang
:
Compact TSV-Based Hairpin Bandpass Filter for Thz Applications. IEEE Access 9: 132078-132083 (2021) - [j7]Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang:
TSV-based hairpin bandpass filter for 6G mobile communication applications. IEICE Electron. Express 18(15): 20210247 (2021) - [j6]Xiangkun Yin, Fengjuan Wang:
Analytical models of AC inductance and quality factor for TSV-based inductor. IEICE Electron. Express 18(18): 20210319 (2021) - [j5]Fengjuan Wang
, Ruinan Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang:
A transformer with high coupling coefficient and small area based on TSV. Integr. 81: 211-220 (2021) - [j4]Xiangkun Yin
, Fengjuan Wang
, Vasilis F. Pavlidis, Xiaoxian Liu
, Qijun Lu, Tao Zhang, Yang Liu:
Design of compact LC lowpass filters based on coaxial through-silicon vias array. Microelectron. J. 116: 105217 (2021) - 2020
- [j3]Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang:
Physics based scalable inductance model for three-dimensional solenoid inductors. Microelectron. J. 103: 104867 (2020)
2010 – 2019
- 2019
- [j2]Yang Liu
, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang:
Electromagnetic modeling and analysis of the tapered differential through glass vias. Microelectron. J. 83: 27-31 (2019) - 2018
- [c1]Yang Liu, Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang:
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density. APCCAS 2018: 439-442 - 2015
- [j1]Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang:
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon. IEICE Electron. Express 12(14): 20150434 (2015)
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last updated on 2024-04-25 05:48 CEST by the dblp team
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