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2020 – today
- 2021
[j8]Muhammad Naqib Nashrudin
, Aizat Abas, M. Z. Abdullah, M. Yusuf Tura Ali, Z. Samsudin, Idris Mansor:
No-flow underfill: Effect of chip placement speed on the void formation using numerical method. Microelectron. J. 114: 105139 (2021)
2010 – 2019
- 2018
- [j7]Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah:
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. Microelectron. Reliab. 81: 41-63 (2018) - 2017
- [j6]Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali:
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. Microelectron. Reliab. 72: 45-64 (2017) - [j5]M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, Abdullah Aziz Saad, Mohd Zulkifly Abdullah:
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO2 nano-reinforced lead free solder at different weighted percentages. Microelectron. Reliab. 79: 336-351 (2017) - 2016
- [j4]Aizat Abas, Noorhafizah Hafizah Mokhtar, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Ang H. O. Tian:
Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem. Comput. Math. Methods Medicine 2016: 6143126:1-6143126:17 (2016) - [j3]Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor:
Lattice Boltzmann method study of bga bump arrangements on void formation. Microelectron. Reliab. 56: 170-181 (2016) - [j2]Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Aizat Abas:
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process. Microelectron. Reliab. 65: 205-216 (2016) - [j1]Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz:
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. Microelectron. Reliab. 66: 143-160 (2016)
Coauthor Index
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