BibTeX records: In Hak Baick

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@inproceedings{DBLP:conf/irps/JeongKKKLCBKJSP18,
  author    = {Seongwon Jeong and
               Jinseok Kim and
               Ayoung Kim and
               Byungwook Kim and
               Moonsoo Lee and
               Jaewon Chang and
               In Hak Baick and
               Hanbyul Kang and
               Younggeun Ji and
               Sangchul Shin and
               Sangwoo Pae},
  title     = {Optimal design of dummy ball array in wafer level package to improve
               board level thermal cycle reliability {(BLR)}},
  booktitle = {{IRPS}},
  pages     = {3},
  publisher = {{IEEE}},
  year      = {2018}
}
@inproceedings{DBLP:conf/irps/ChunBHKLKPP15,
  author    = {Hyunsuk Chun and
               In Hak Baick and
               Sangsu Ha and
               Eunmi Kwon and
               Seungbae Lee and
               Seil Kim and
               Sangwoo Pae and
               Jongwoo Park},
  title     = {{CPI} reliability and {EMI} benefit for {MIM} {CAP} embedded {C4}
               package},
  booktitle = {{IRPS}},
  pages     = {5},
  publisher = {{IEEE}},
  year      = {2015}
}
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