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Do-Seop Kim

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2000 – 2009

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2008
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Qiang Yu, Tadahiro Shibutani, Do-Seop Kim, Yusuke Kobayashi, Jidong Yang, Masaki Shiratori:
Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints. Microelectron. Reliab. 48(3): 431-437 (2008)

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