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Geert Van Steenberge
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Journal Articles
- 2023
- [j4]Georgios Syriopoulos, Ioannis Poulopoulos, Charalampos Zervos, Evrydiki Kyriazi, Aggelos G. Poulimenos, Michal Szaj, Jeroen Missinne, Geert Van Steenberge, Hercules Avramopoulos:
Photonic Integrated Circuit Based Temperature Sensor for Out-of-Autoclave Composite Parts Production Monitoring. Sensors 23(18): 7765 (2023) - 2020
- [j3]Marie-Aline Mattelin, Jeroen Missinne, Bert De Coensel, Geert Van Steenberge:
Imprinted Polymer-Based Guided Mode Resonance Grating Strain Sensors. Sensors 20(11): 3221 (2020) - 2018
- [j2]Jeroen Missinne, Nuria Teigell Benéitez, Marie-Aline Mattelin, Alfredo Lamberti, Geert Luyckx, Wim Van Paepegem, Geert Van Steenberge:
Bragg-Grating-Based Photonic Strain and Temperature Sensor Foils Realized Using Imprinting and Operating at Very Near Infrared Wavelengths. Sensors 18(8): 2717 (2018) - 2012
- [j1]Bram Van Hoe, Graham Lee, Erwin Bosman, Jeroen Missinne, Sandeep Kalathimekkad, Oliver Maskery, David J. Webb, Kate Sugden, Peter Van Daele, Geert Van Steenberge:
Ultra Small Integrated Optical Fiber Sensing System. Sensors 12(9): 12052-12069 (2012)
Conference and Workshop Papers
- 2024
- [c5]Jef Van Asch, Jeroen Missinne, Junwen He, Pengfei Xu, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Huseyin Sar, Hakim Kobbi, Swetanshu Bipul, Dieter Bode, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout, Geert Van Steenberge:
Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics. OFC 2024: 1-3 - 2018
- [c4]Joris Van Kerrebrouck, Lu Zhang, Rui Lin, Xiaodan Pang, Aleksejs Udalcovs, Oskars Ozolins, Silvia Spiga, Markus-Christian Amann, Geert Van Steenberge, Lin Gan, Ming Tang, Songnian Fu, Richard Schatz, Sergei Popov, Deming Liu, Weijun Tong, Shilin Xiao, Guy Torfs, Jiajia Chen, Johan Bauwelinck, Xin Yin:
726.7-Gb/s 1.5-μm Single-Mode VCSEL Discrete Multi-Tone Transmission over 2.5-km Multicore Fiber. OFC 2018: 1-3 - [c3]Nivesh Mangal, Jeroen Missinne, Gunther Roelkens, Joris Van Campenhout, Geert Van Steenberge, Brad Snyder:
Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics. OFC 2018: 1-3 - [c2]Xiaodan Pang, Joris Van Kerrebrouck, Oskars Ozolins, Rui Lin, Aleksejs Udalcovs, Lu Zhang, Silvia Spiga, Markus-Christian Amann, Geert Van Steenberge, Lin Gan, Ming Tang, Songnian Fu, Richard Schatz, Gunnar Jacobsen, Sergei Popov, Deming Liu, Weijun Tong, Guy Torfs, Johan Bauwelinck, Xin Yin, Jiajia Chen:
7×100 Gbps PAM-4 Transmission over 1-km and 10-km Single Mode 7-core Fiber using 1.5-μm SM-VCSEL. OFC 2018: 1-3 - 2015
- [c1]Kamal S. Kaur, Ananth Z. Subramanian, Rik Verplancke, P. Cardile, Joris Van Kerrebrouck, Silvia Spiga, R. Meyer, Johan Bauwelinck, Roel Baets, Geert Van Steenberge:
Flip-chip bonding of VCSELs to silicon grating couplers via SU8 prisms fabricated using laser ablation. ECOC 2015: 1-3
Coauthor Index
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