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2020 – today
- 2025
[j10]Tianming Ni, Fei Li, Zhengfeng Huang, Aibin Yan, Senling Wang, Xiaoqing Wen, Mu Nie, Jingchang Bian
:
A lightweight general PUF framework for resisting machine learning attacks. Integr. 104: 102459 (2025)- [j9]Tianming Ni, Hao Wu, Fei Li, Mu Nie, Yun Liu, Ang Hu, Jingchang Bian:
Authentication scheme resistant to machine learning based on obfuscation of multiple PUF responses. Microelectron. J. 166: 106867 (2025) - [j8]Tianming Ni, Wen Jiang, Huaguo Liang, Xiaoqing Wen, Mu Nie:
Segmentation-Enhanced Overlapped Defect Identification for Multipatterns Wafer Maps. IEEE Trans. Instrum. Meas. 74: 1-11 (2025) - [j7]Tianming Ni, Hao Wu, Mu Nie, Aibin Yan, Senling Wang, Xiaoqing Wen, Jingchang Bian:
A Response-Nonlinearized DEMUX-TDC PUF for Resistance Against Modeling Attacks and Secure Authentication Protocols. IEEE Trans. Very Large Scale Integr. Syst. 33(10): 2606-2619 (2025) - [c3]Mu Nie, Shidong Zhu, Aibin Yan, Cheng Zhuo, Xiaoqing Wen, Tianming Ni:
Efficient Modulated State Space Model for Mixed-Type Wafer Defect Pattern Recognition. DATE 2025: 1-6 - 2024
- [j6]Tianming Ni, Kejie Xu, Hao Wu, Senling Wang, Mu Nie:
A demultiplexer-based dual-path switching true random number generator. Microelectron. J. 151: 106363 (2024) - 2023
- [j5]Mu Nie, Zhibin Quan, Weiping Ding, Wankou Yang:
Enhancing motion visual cues for self-supervised video representation learning. Eng. Appl. Artif. Intell. 123(Part A): 106203 (2023) - [j4]Mu Nie, Sen Yang, Zhenhua Wang, Baochang Zhang, Huimin Lu, Wankou Yang:
Multi-receptive field spatiotemporal network for action recognition. Int. J. Mach. Learn. Cybern. 14(7): 2439-2453 (2023) - [c2]Mu Nie, Wen Jiang, Wankou Yang, Senling Wang, Xiaoqing Wen, Tianming Ni:
Enhancing Defect Diagnosis and Localization in Wafer Map Testing Through Weakly Supervised Learning. ATS 2023: 1-6 - 2022
- [j3]Tianming Ni, Jingchang Bian, Zhao Yang, Mu Nie, Liang Yao, Zhengfeng Huang, Aibin Yan, Xiaoqing Wen:
Broadcast-TDMA: A Cost-Effective Fault-Tolerance Method for TSV Lifetime Reliability Enhancement. IEEE Des. Test 39(5): 34-42 (2022) - 2021
- [c1]Sen Yang, Zhibin Quan, Mu Nie, Wankou Yang:
TransPose: Keypoint Localization via Transformer. ICCV 2021: 11782-11792 - 2020
- [i1]Sen Yang, Zhibin Quan, Mu Nie, Wankou Yang:
TransPose: Towards Explainable Human Pose Estimation by Transformer. CoRR abs/2012.14214 (2020)
2010 – 2019
- 2017
- [j2]Tianming Ni, Mu Nie, Huaguo Liang, Jingchang Bian, Xiumin Xu, Xiangsheng Fang, Zhengfeng Huang, Xiaoqing Wen:
Vernier ring based pre-bond through silicon vias test in 3D ICs. IEICE Electron. Express 14(18): 20170590 (2017) - [j1]Tianming Ni, Huaguo Liang, Mu Nie, Xiumin Xu, Aibin Yan, Zhengfeng Huang:
A Region-Based Through-Silicon via Repair Method for Clustered Faults. IEICE Trans. Electron. 100-C(12): 1108-1117 (2017)
Coauthor Index
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