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Mohamed El-Sayed 0011
Person information
- affiliation: Egypt-Japan University of Science and Technology (E-JUST), Department of Electronics and Communications, Alexandria, Egypt
- affiliation (former): Alexandria University, Electrical Engineering Department, Egypt
- affiliation (PhD 1984): Grenoble Institute of Technology (Grenoble INO), France
Other persons with the same name
- Mohamed Elsayed (aka: Mohamed ElSayed, Mohamed El-Sayed) — disambiguation page
- Mohamed El-Sayed 0005 (aka: Mohamed Elsayed 0005) — Alexandria University, Egypt
- Mohamed El-Sayed 0007 (aka: Mohamed Elsayed 0007) — Alcatel-Lucent Bell Labs, Murray Hill, NJ, USA (and 1 more)
- Mohamed Elsayed 0001
— Benha University, Faculty of Engineering, Banha, Egypt
- Mohamed Elsayed 0002
— Memorial University of Newfoundland, Faculty of Engineering and Applied Science, St. John's, NL, Canada (and 1 more)
- Mohamed Elsayed 0003
— University of Alberta, Department of Computing Science, Edmonton, AB, Canada (and 1 more)
- Mohamed Elsayed 0004 (aka: Mohamed Sabry Abd Elraheam Elsayed) — British University in Egypt, Department of Computer Science, Cairo, Egypt
- Mohamed ElSayed 0006 (aka: Mohamed Elsayed 0006) — Nile University, Center for Informatics Science, Cairo, Egypt
- Mohamed Elsayed 0008 — University of Toronto, ON, Canada
- Mohamed Elsayed 0009 — Huawei Technologies, Noah's Ark Lab
- Mohamed Elsayed 0010 — Qatar University, Department of Electrical Engineering, Doha, Qatar
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2020 – today
- 2023
- [c4]Mohamed Elsayed, Sama Hadhoud, Alaa Elsetohy, Menna Osman, Walid Gomaa:
Non-Parallel Training Approach for Emotional Voice Conversion Using CycleGAN. ICINCO (2) 2023: 17-24
2010 – 2019
- 2016
- [j1]Mostafa Said
, Ahmed Shalaby
, Farhad Mehdipour, Morteza Biglari-Abhari, Mohamed El-Sayed:
A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias. Microprocess. Microsystems 43: 26-46 (2016) - 2014
- [c3]Mostafa Said, Farhad Mehdipour, Kazuaki J. Murakami, Mohamed El-Sayed:
A Design Methodology for Performance Maintenance of 3D Network-on-Chip with Multiplexed Through-Silicon Vias. MES@ISCA 2014: 9-16 - [c2]Mostafa Said, Mohamed El-Sayed, Farhad Mehdipour, Nobuaki Miyakawa:
Keep-Out-Zone analysis for three-dimensional ICs. VLSI-DAT 2014: 1-4 - 2013
- [c1]Mostafa Said, Farhad Mehdipour, Mohamed El-Sayed:
Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias. DSD 2013: 925-932
Coauthor Index
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