Thermal deformation measurements and predictions of MAP-BGA electronic packages.

Sun, 01 Jan 2006 00:00:00 +0100

Ming-Yi Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu:
Thermal deformation measurements and predictions of MAP-BGA electronic packages. Microelectron. Reliab. 46(2-4): 476-486 (2006)