BibTeX records: Paresh Limaye

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@article{DBLP:journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11,
  author    = {Geert Van der Plas and
               Paresh Limaye and
               Igor Loi and
               Abdelkarim Mercha and
               Herman Oprins and
               Cristina Torregiani and
               Steven Thijs and
               Dimitri Linten and
               Michele Stucchi and
               Guruprasad Katti and
               Dimitrios Velenis and
               Vladimir Cherman and
               Bart Vandevelde and
               Veerle Simons and
               Ingrid De Wolf and
               Riet Labie and
               Dan Perry and
               Stephane Bronckers and
               Nikolaos Minas and
               Miro Cupac and
               Wouter Ruythooren and
               Jan Van Olmen and
               Alain Phommahaxay and
               Muriel de Potter de ten Broeck and
               Ann Opdebeeck and
               Michal Rakowski and
               Bart De Wachter and
               Morin Dehan and
               Marc Nelis and
               Rahul Agarwal and
               Antonio Pullini and
               Federico Angiolini and
               Luca Benini and
               Wim Dehaene and
               Youssef Travaly and
               Eric Beyne and
               Paul Marchal},
  title     = {Design Issues and Considerations for Low-Cost 3-D {TSV} {IC} Technology},
  journal   = {{IEEE} J. Solid State Circuits},
  volume    = {46},
  number    = {1},
  pages     = {293--307},
  year      = {2011},
  url       = {https://doi.org/10.1109/JSSC.2010.2074070},
  doi       = {10.1109/JSSC.2010.2074070},
  timestamp = {Sun, 30 Aug 2020 01:00:00 +0200},
  biburl    = {https://dblp.org/rec/journals/jssc/PlasLLMOTTLSKVCVSWLPBMCROPBORWDNAPABDTBM11.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/cicc/PlasTLKLMSOVMCDNADTBM10,
  author    = {Geert Van der Plas and
               Steven Thijs and
               Dimitri Linten and
               Guruprasad Katti and
               Paresh Limaye and
               Abdelkarim Mercha and
               Michele Stucchi and
               Herman Oprins and
               Bart Vandevelde and
               Nikolaos Minas and
               Miro Cupac and
               Morin Dehan and
               Marc Nelis and
               Rahul Agarwal and
               Wim Dehaene and
               Youssef Travaly and
               Eric Beyne and
               Paul Marchal},
  editor    = {Jacqueline Snyder and
               Rakesh Patel and
               Tom Andre},
  title     = {Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack
               - Challenges and solutions},
  booktitle = {{IEEE} Custom Integrated Circuits Conference, {CICC} 2010, San Jose,
               California, USA, 19-22 September, 2010, Proceedings},
  pages     = {1--4},
  publisher = {{IEEE}},
  year      = {2010},
  url       = {https://doi.org/10.1109/CICC.2010.5617425},
  doi       = {10.1109/CICC.2010.5617425},
  timestamp = {Wed, 16 Oct 2019 14:14:52 +0200},
  biburl    = {https://dblp.org/rec/conf/cicc/PlasTLKLMSOVMCDNADTBM10.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@inproceedings{DBLP:conf/isscc/PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10,
  author    = {Geert Van der Plas and
               Paresh Limaye and
               Abdelkarim Mercha and
               Herman Oprins and
               Cristina Torregiani and
               Steven Thijs and
               Dimitri Linten and
               Michele Stucchi and
               Guruprasad Katti and
               Dimitrios Velenis and
               Domae Shinichi and
               Vladimir Cherman and
               Bart Vandevelde and
               Veerle Simons and
               Ingrid De Wolf and
               Riet Labie and
               Dan Perry and
               Stephane Bronckers and
               Nikolaos Minas and
               Miro Cupac and
               Wouter Ruythooren and
               Jan Van Olmen and
               Alain Phommahaxay and
               Muriel de Potter de ten Broeck and
               Ann Opdebeeck and
               Michal Rakowski and
               Bart De Wachter and
               Morin Dehan and
               Marc Nelis and
               Rahul Agarwal and
               Wim Dehaene and
               Youssef Travaly and
               Pol Marchal and
               Eric Beyne},
  title     = {Design issues and considerations for low-cost 3D {TSV} {IC} technology},
  booktitle = {{IEEE} International Solid-State Circuits Conference, {ISSCC} 2010,
               Digest of Technical Papers, San Francisco, CA, USA, 7-11 February,
               2010},
  pages     = {148--149},
  publisher = {{IEEE}},
  year      = {2010},
  url       = {https://doi.org/10.1109/ISSCC.2010.5434016},
  doi       = {10.1109/ISSCC.2010.5434016},
  timestamp = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl    = {https://dblp.org/rec/conf/isscc/PlasLMOTTLSKVSCVSWLPBMCROPBORWDNADTMB10.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/SteenbergeLWVS07,
  author    = {Nele Van Steenberge and
               Paresh Limaye and
               Geert Willems and
               Bart Vandevelde and
               Inge Schildermans},
  title     = {Analytical and finite element models of the thermal behavior for lead-free
               soldering processes in electronic assembly},
  journal   = {Microelectron. Reliab.},
  volume    = {47},
  number    = {2-3},
  pages     = {215--222},
  year      = {2007},
  url       = {https://doi.org/10.1016/j.microrel.2006.09.010},
  doi       = {10.1016/j.microrel.2006.09.010},
  timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl    = {https://dblp.org/rec/journals/mr/SteenbergeLWVS07.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@article{DBLP:journals/mr/VandeveldeGLRB07,
  author    = {Bart Vandevelde and
               Mario Gonzalez and
               Paresh Limaye and
               Petar Ratchev and
               Eric Beyne},
  title     = {Thermal cycling reliability of SnAgCu and SnPb solder joints: {A}
               comparison for several IC-packages},
  journal   = {Microelectron. Reliab.},
  volume    = {47},
  number    = {2-3},
  pages     = {259--265},
  year      = {2007},
  url       = {https://doi.org/10.1016/j.microrel.2006.09.034},
  doi       = {10.1016/j.microrel.2006.09.034},
  timestamp = {Sat, 22 Feb 2020 00:00:00 +0100},
  biburl    = {https://dblp.org/rec/journals/mr/VandeveldeGLRB07.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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