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Ting-Chen Tsan

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2020 – today

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2021
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  - journals/mva/TsanSF21
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Ting-Chen Tsan, Teng-Fu Shih, Chiou-Shann Fuh:
TsanKit: artificial intelligence for solder ball head-in-pillow defect inspection. Mach. Vis. Appl. 32(3): 66 (2021)

2010 – 2019

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2018
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Bing-Jhang Lin, Ting-Chen Tsan, Tzu-Chia Tung, You-Hsien Lee, Chiou-Shann Fuh:
Use 3D Convolutional Neural Network to Inspect Solder Ball Defects. ICONIP (1) 2018: 263-274
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Ting-Chen Tsan, Bing-Jhang Lin, You-Hsien Lee, Tzu-Chia Tung, Chiou-Shann Fuh:
Solder Ball 3D Reconstruction with X-Ray Images Using Filtered Back Projection. TENCON 2018: 2510-2515

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