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Ute Troppenz

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Journal Articles

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2006
[j1]
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  - journals/mr/FleischerTHJ06
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  - https://dblp.org/rec/journals/mr/FleischerTHJ06
Amy S. Fleischer, Ute Troppenz, Michael Hamacher, Werner John:
Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser. Microelectron. Reliab. 46(2-4): 421-431 (2006)

Conference and Workshop Papers

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2023
[c10]
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  - conf/ofc/BeckerwerthKJTM23
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Tobias Beckerwerth, Christoph Kottke, Volker Jungnickel, Ute Troppenz, Martin Möhrle, Patrick Runge, Martin Schell:
56 GBaud PAM-4 Direct Detection with High-Speed Avalanche Photodiodes. OFC 2023: 1-3
[c9]
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Michael Theurer, Christoph Kottke, Ronald Freund, Felix Ganzer, Patrick Runge, Martin Moehrle, Ute Troppenz, Ariane Sigmund, Martin Schell:
4 x 200 Gb/s EML-Array with a Single MQW Layer Stack. OFC 2023: 1-4
2022
[c8]
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Ute Troppenz, Michael Theurer, Martin Moehrle, Ariane Sigmund, Marko Gruner, Martin Schell:
Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays. OFC 2022: 1-3
2020
[c7]
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Yilin Xu, Pascal Maier, Matthias Blaicher, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Wladislaw Hartmann, Muhammad Rodlin Billah, Ute Troppenz, Martin Möhrle, Sebastian Randel, Wolfgang Freude, Christian Koos:
InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements. OFC 2020: 1-3
2017
[c6]
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  - conf/ecoc/BillahKMBKKZDWH17
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Muhammad Rodlin Billah, Juned N. Kemal, Pablo Marin-Palomo, Matthias Blaicher, Yasar Kutuvantavida, Clemens Kieninger, Heiner Zwickel, Philipp-Immanuel Dietrich, Stefan Wolf, Tobias Hoose, Yilin Xu, Ute Troppenz, Martin Möhrle, Sebastian Randel, Wolfgang Freude, Christian Koos:
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators. ECOC 2017: 1-3
[c5]
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Muhammad Rodlin Billah, Matthias Blaicher, Juned N. Kemal, Tobias Hoose, Heiner Zwickel, Philipp-Immanuel Dietrich, Ute Troppenz, Martin Möhrle, Florian Merget, A. Hofmann, Jeremy Witzens, Sebastian Randel, Wolfgang Freude, Christian Koos:
8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding. OFC 2017: 1-3
[c4]
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Jung Han Choi, Marko Gruner, Heinz-Gunter Bach, Michael Theurer, Ute Troppenz, Martin Möhrle, Martin Schell:
Ultra-low power SiGe driver-IC for high-speed electroabsorption modulated DFB lasers. OFC 2017: 1-3
[c3]
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Michael Theurer, Martin Moehrle, Ute Troppenz, Heinz-Gunter Bach, Ariane Sigmund, Georges Przyrembel, Martin Schell:
4 × 56 Gb/s high output power electroabsorption modulated laser array. OFC 2017: 1-3
2016
[c2]
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  - conf/ofc/HooseBBMDHTMLTS16
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Tobias Hoose, Muhammad Rodlin Billah, Matthias Blaicher, Pablo Marin, Philipp-Immanuel Dietrich, Andreas Hofmann, Ute Troppenz, Martin Möhrle, Nicole Lindenmann, M. Thiel, P. Simon, Jörg Hoffmann, M. L. Goedecke, Wolfgang Freude, Christian Koos:
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips. OFC 2016: 1-3
[c1]
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Michael Theurer, Yin Wang, Li Zeng, Ute Troppenz, Georges Przyrembel, Ariane Sigmund, Martin Moehrle, Martin Schell:
2 × 56 GB/s from a double side electroabsorption modulated DFB laser. OFC 2016: 1-3

Coauthor Index

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