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Marwan Khater
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2010 – 2019
- 2017
- [c8]Jessie C. Rosenberg, Folkert Horst, Marwan Khater, Frederick G. Anderson, Robert Leidy, Tymon Barwicz, Douglas M. Gill, Edward Kiewra, Yves Martin, Jason S. Orcutt, Andreas D. Stricker, Charles Whiting, Kate McLean, Bruce Porth, Chi Xiong, Natalie B. Feilchenfeld, Ken Giewont, Karen Nummy, Bert J. Offrein, Wilfried Haensch, William M. J. Green:
Monolithic Silicon Photonic WDM Transceivers. ECOC 2017: 1-3 - [c7]Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer:
High-throughput photonic packaging. OFC 2017: 1-3 - [c6]Bo Peng, Chi Xiong, Marwan Khater, Asger S. Jensen, William M. J. Green, Tymon Barwicz:
Metamaterial waveguides with low distributed backscattering in production O-band Si photonics. OFC 2017: 1-3 - 2016
- [c5]Jason S. Orcutt, Douglas M. Gill, Jonathan E. Proesel, John J. Ellis-Monaghan, Folkert Horst, Tymon Barwicz, Chi Xiong, Frederick G. Anderson, Ankur Agrawal, Yves Martin, Christian W. Baks, Marwan Khater, Jessie C. Rosenberg, W. D. Sacher, Jens Hofrichter, Edward Kiewra, Andreas D. Stricker, Frank Libsch, Bert Jan Offrein, Mounir Meghelli, Natalie B. Feilchenfeld, Wilfried Haensch, William M. J. Green:
Monolithic silicon photonics at 25 Gb/s. OFC 2016: 1-3 - 2015
- [c4]Tymon Barwicz, Alexander Janta-Polczynski, Marwan Khater, Yan Thibodeau, Robert Leidy, Jeffrey Maling, Stephan Martel, Sebastian Engelmann, Jason S. Orcutt, Paul Fortier, William M. J. Green:
An o-band metamaterial converter interfacing standard optical fibers to silicon nanophotonic waveguides. OFC 2015: 1-3 - [c3]Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae-Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, Paul Fortier:
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability. OFC 2015: 1-3 - 2013
- [c2]Solomon Assefa, Huapu Pan, Steven Shank, William M. J. Green, Alexander V. Rylyakov, Clint Schow, Marwan Khater, Swetha Kamlapurkar, Edward Kiewra, Carol Reinholm, Teya Topuria, Philip Rice, Christian W. Baks, Yurii A. Vlasov:
Monolithically integrated silicon nanophotonics receiver in 90nm CMOS technology node. OFC/NFOEC 2013: 1-3
2000 – 2009
- 2006
- [c1]James S. Dunn, David L. Harame, Alvin J. Joseph, Stephen A. St. Onge, Natalie B. Feilchenfeld, Louis D. Lanzerotti, Bradley A. Orner, Ephrem G. Gebreselasie, Jeffrey B. Johnson, Douglas D. Coolbaugh, Rick Rassel, Marwan Khater:
SiGe BiCMOS Trends - Today and Tomorrow. CICC 2006: 695-702
Coauthor Index
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