Ryo Mochizuki

Name: dblp XML data dump
Creator: Schloss Dagstuhl - Leibniz Center for Informatics
Published: 1993
License: https://creativecommons.org/publicdomain/zero/1.0/
Keywords: dblp, XML, computer science, scholarly publications, metadata

◀ ▶ joint publications with Tetsunori Kobayashi

> Home > Persons > Ryo Mochizuki

Publications

2007
[j3]
- view
  authority control:
- export record
  dblp key:
  - journals/scjapan/MochizukiOK07
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/scjapan/MochizukiOK07
Ryo Mochizuki, Tadashi Okubo, Tetsunori Kobayashi:
Spectrum conversion using prosodic information. Syst. Comput. Jpn. 38(10): 12-20 (2007)
2006
[j2]
- view
  authority control:
- export record
  dblp key:
  - journals/ieicet/OkuboMK06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ieicet/OkuboMK06
Tadashi Okubo, Ryo Mochizuki, Tetsunori Kobayashi:
Hybrid Voice Conversion of Unit Selection and Generation Using Prosody Dependent HMM. IEICE Trans. Inf. Syst. 89-D(11): 2775-2782 (2006)
2004
[j1]
- view
  - electronic edition @ ieice.org
  - details & citations
- export record
  dblp key:
  - journals/ieicet/MochizukiK04
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/ieicet/MochizukiK04
Ryo Mochizuki, Tetsunori Kobayashi:
A Low-Band Spectrum Envelope Reconstruction Method for PSOLA-Based F₀ Modification. IEICE Trans. Inf. Syst. 87-D(10): 2426-2429 (2004)
[c5]
- view
  authority control:
- export record
  dblp key:
  - conf/icassp/MochizukiK04
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icassp/MochizukiK04
Ryo Mochizuki, Tetsunori Kobayashi:
A low-band spectrum envelope modeling for high quality pitch modification. ICASSP (1) 2004: 645-648

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.