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Keith W. Sweatman

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2010 – 2019

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2018
[j2]
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  - journals/mr/LiuMSN18
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  - https://dblp.org/rec/journals/mr/LiuMSN18
Shi-Qian Liu, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita:
The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review. Microelectron. Reliab. 84: 170-180 (2018)
2011
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H. Tsukamoto, T. Nishimura, S. Suenaga, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita:
The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectron. Reliab. 51(3): 657-667 (2011)

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