Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems.

Thu, 01 Jan 2004 00:00:00 +0100

Yi Tao, Ajay P. Malshe, William D. Brown:
Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems. Microelectron. Reliab. 44(2): 251-258 (2004)