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Edmund D. Blackshear

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2010 – 2019

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2019
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Zhuo-Jie Wu, Manish Nayini, Charles Carey, Samantha Donovan, David Questad, Edmund D. Blackshear:
CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate. IRPS 2019: 1-7

2000 – 2009

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2005
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Edmund D. Blackshear, Moises Cases, Erich Klink, Stephen R. Engle, Ronald S. Malfatt, Daniel N. deAraujo, Stefano Oggioni, Luke D. Lacroix, Jamil A. Wakil, Nam H. Pham, Gareth G. Hougham, David J. Russell:
The evolution of build-up package technology and its design challenges. IBM J. Res. Dev. 49(4-5): 641-662 (2005)

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