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ORCIDYi Zhao 0001
Person information
- affiliation: University of Southampton, UK
Other persons with the same name
- Yi Zhao — disambiguation page
- Yi Zhao 0002
![[0000-0002-1765-8787]](https://dblp.dagstuhl.de/img/orcid-mark.12x12.png "0000-0002-1765-8787")
— Shenzhen University, College of Mathematics and Statistics, China (and 1 more) - Yi Zhao 0003 — Marvell Semiconductor, Santa Clara, CA, USA (and 1 more)
- Yi Zhao 0004 — Ohio State University, Columbus, OH, USA (and 1 more)
- Yi Zhao 0005 — Georgia State University, Department of Mathematics and Statistics, Atlanta, GA, USA
- Yi Zhao 0006 — University of Tokyo, Department of Electrical Engineering and Information Systems, Japan
- Yi Zhao 0007 — Harbin Institute of Technology, Shenzhen Graduate School, College of Science, China (and 1 more)
- Yi Zhao 0008 — Xiamen University, Department of Chemistry, China
- Yi Zhao 0009 — Hohai University, Department of Geomatics Engineering, Nanjing, China
- Yi Zhao 0010 — Beijing University of Chemical Technology, Beijing Key Laboratory for Health Monitoring and Self-Recovery of High End Mechanical Equipment, China
- Yi Zhao 0011 — Tsinghua University, Department of Computer Science and Technology, China
- Yi Zhao 0012 — University of Bonn, Germany
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Books and Theses
- 2014
[b1]Yi Zhao:
Investigation into yield and reliability enhancement of TSV-based three-dimensional integration circuits. University of Southampton, UK, 2014
Journal Articles
- 2015
- [j1]Yi Zhao, S. Saqib Khursheed, Bashir M. Al-Hashimi:
Online Fault Tolerance Technique for TSV-Based 3-D-IC. IEEE Trans. Very Large Scale Integr. Syst. 23(8): 1567-1571 (2015)
Conference and Workshop Papers
- 2016
- [c2]Yi Zhao, S. Saqib Khursheed, Bashir M. Al-Hashimi, Zhiwen Zhao:
Co-optimization of fault tolerance, wirelength and temperature mitigation in TSV-based 3D ICs. VLSI-SoC 2016: 1-6 - 2011
- [c1]Yi Zhao, S. Saqib Khursheed, Bashir M. Al-Hashimi:
Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs. Asian Test Symposium 2011: 201-206
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