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Yii-Der Wu

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Journal Articles

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2008
[j3]
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  dblp key:
  - journals/mr/ChienCLHWY08
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  persistent URL:
  - https://dblp.org/rec/journals/mr/ChienCLHWY08
Chi-Hui Chien, Thaiping Chen, Wei-Bang Lin, Chi-Chang Hsieh, Yii-Der Wu, Cheng-Hsiu Yeh:
Experimental and statistical study in adhesion features of bonded interfaces of IC packages. Microelectron. Reliab. 48(1): 140-148 (2008)
2006
[j2]
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  - journals/mr/ChienCCCHW06
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  - https://dblp.org/rec/journals/mr/ChienCCCHW06
Chi-Hui Chien, Thaiping Chen, Yung-Chang Chen, Yii-Tay Chiou, Chi-Chang Hsieh, Yii-Der Wu:
Stability of the warpage in a PBGA package subjected to hygro-thermal loading. Microelectron. Reliab. 46(7): 1139-1147 (2006)
2003
[j1]
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  - journals/mr/ChienCCCHYCW03
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Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu:
Influences of the moisture absorption on PBGA package's warpage during IR reflow process. Microelectron. Reliab. 43(1): 131-139 (2003)

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