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ORCIDShiv Govind Singh
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2020 – today
- 2024
[j3]V. Bharath Sreenivasulu
, Aruna Kumari Neelam, Asisa Kumar Panigrahy, Lokesh Vakkalakula, Jawar Singh, Shiv Govind Singh:
Benchmarking of Multi-Bridge-Channel FETs Toward Analog and Mixed-Mode Circuit Applications. IEEE Access 12: 7531-7539 (2024)- 2023
- [c44]Partha Pratim Goswami, Swati Mohanty, Ullas Pandey, Shiv Govind Singh:
An Android Based Portable Biosensor System for Cardiac Risk-Stratification by Detecting HFABP in Human Plasma. SENSORS 2023: 1-4 - 2022
- [c43]Satish Bonam, Jose Joseph, Aditya Bhagavathi, Shiv Govind Singh, Siva Rama Krishna Vanjari:
Silk Piezoelectric Tactile Sensors: The Way Forward to Developing Intelligent Implantable Sensors. ISCAS 2022: 2225-2228 - 2021
- [c42]Nisha Gupta, Ashudeb Dutta, Shiv Govind Singh:
A Novel Down Conversion Mixer with Low/High Band Re-configurable Transconductance Amplifier in 65nm CMOS Process. LASCAS 2021: 1-4
2010 – 2019
- 2018
- [c41]D. V. Santhosh Kumar Gunapu, Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari:
Selective Anisotropic Dry Etching of Piezoelectric Silk Microstructures Using Oxygen Plasma Ashing. IEEE SENSORS 2018: 1-4 - [c40]Jose Joseph, Manish Kumar, Survasnata Trinathy, G. D. V. Santhosh Kumar, Shiv Govind Singh, Siva Rama Krishna Vanjari:
Exploring the Piezoelectric Property of Electrospun Silk Nanofibers for Sensing Applications. IEEE SENSORS 2018: 1-3 - [c39]Jose Joseph, Manish Kumar, Suryasnata Tripathy, G. D. V. Santhosh Kumar, Shiv Govind Singh, Siva Rama Krishna Vanjari:
A Highly Flexible Tactile Sensor with Self-Poled Electrospun PVDF Nanofiber. IEEE SENSORS 2018: 1-4 - [c38]Lisa Sarkar, Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari:
Modeling and Fabrication Aspects of PVDF as a Membrane Material for Air Borne PMUT Applications. IEEE SENSORS 2018: 1-4 - 2017
- [j2]Satya Trinadh Adireddy, Seetal Potluri, Ch. Sobhan Babu, Veezhinathan Kamakoti, Shiv Govind Singh:
Optimal Don't Care Filling for Minimizing Peak Toggles During At-Speed Stuck-At Testing. ACM Trans. Design Autom. Electr. Syst. 23(1): 5:1-5:26 (2017) - [c37]Sanghamitra Debroy, Amit Acharyya, Shiv Govind Singh, Swati Ghosh Acharyya:
Area-elficient interlayer signal propagation in 3D IC by introducing electron spin. ECCTD 2017: 1-4 - [c36]Suryasnata Tripathy, Arun Naithani, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Electrospun polyaniline nanofiber based chemiresistive nanobiosensor platform for DNA Hybridization detection. IEEE SENSORS 2017: 1-3 - [c35]Anand Kakarla, Asif Qureshi, Thatikonda Shashidhar, Swades De, Shiv Govind Singh, Soumya Jana:
Source localization via aermod-based simulation under mean squared error criterion: Demonstration using field data. IGARSS 2017: 6201-6204 - 2016
- [j1]Matta Durga Prakash, Siva Rama Krishna Vanjari, Chandra Shekhar Sharma, Shiv Govind Singh:
Ultrasensitive, Label Free, Chemiresistive Nanobiosensor Using Multiwalled Carbon Nanotubes Embedded Electrospun SU-8 Nanofibers. Sensors 16(9): 1354 (2016) - [c34]Kumail Khurram, Asisa Kumar Panigrahi, Satish Bonam, Om Krishan Singh, Shiv Govind Singh:
Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. 3DIC 2016: 1-4 - [c33]C. Hemanth Kumar, Asisa Kumar Panigrahi, Om Krishan Singh, Shiv Govind Singh:
Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC. 3DIC 2016: 1-4 - [c32]Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration. 3DIC 2016: 1-4 - [c31]Suraj Patil, Asisa Kumar Panigrahi, Satish Bonam, C. Hemanth Kumar, Om Krishan Singh, Shiv Govind Singh:
Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. 3DIC 2016: 1-4 - [c30]Suraj Singh, Asisa Kumar Panigrahi, Om Krishan Singh, Shiv Govind Singh:
Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC. 3DIC 2016: 1-4 - [c29]K. T. Hafeez, Ashudeb Dutta, Shiv Govind Singh, Krishna Kanth Gowri Avalur:
A compact, resource sharing on-chip soft-start technique for automotive DC-DC converters. APCCAS 2016: 111-114 - [c28]Nagaveni Vamsi, Sesha Sairam Ragulagadda, Ashudeb Dutta, Shiv Govind Singh:
A -34dBm sensitivity battery-less wake-up receiver with digital decoder. APCCAS 2016: 721-724 - [c27]Jose Joseph, Sai Saraswathi, Anshika Agarwal, Shiv Govind Singh, Siva Rama Krishna Vanjari:
Silk piezoelectric thin films: Materials to devices. IEEE SENSORS 2016: 1-3 - [c26]Brince Paul, R. Ranga Reddy, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Zinc oxide nanowire modified flexible plastic platform for immunosensing. IEEE SENSORS 2016: 1-3 - [c25]Nagaveni Vamsi, V. Priya, Ashudeb Dutta, Shiv Govind Singh:
A 1V, -26dBm sensitive auto configurable mixed converter mode RF energy harvesting with wide input range. ISCAS 2016: 1534-1537 - [c24]K. T. Hafeez, Ashudeb Dutta, Shiv Govind Singh, Krishna Kanth Gowri Avalur:
A low-cost multi-phase 3A buck converter with improved ripple cancellation for wide supply range. ISCAS 2016: 1618-1621 - [c23]K. T. Hafeez, Ashudeb Dutta, Shiv Govind Singh, Krishna Kanth Gowri Avalur:
Transient suppression with pseudo error voltage technique for wide supply range automotive DC-DC converters. MWSCAS 2016: 1-4 - 2015
- [c22]Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh:
Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. 3DIC 2015: TS8.13.1-TS8.13.5 - [c21]R. Ranga Reddy, Sugandh Tanna, Shiv Govind Singh, Om Krishna Singh:
TSV noise coupling in 3D IC using guard ring. 3DIC 2015: TS8.35.1-TS8.35.5 - [c20]Satya Trinadh, Ch. Sobhan Babu, Shiv Govind Singh, Seetal Potluri, V. Kamakoti:
DP-fill: a dynamic programming approach to X-filling for minimizing peak test power in scan tests. DATE 2015: 836-841 - [c19]Pankaj Kumar Jha, Pravanjan Patra, Jairaj Naik, Amit Acharyya, Pachamuthu Rajalakshmi, Shiv Govind Singh, Ashudeb Dutta:
A reconfigurable medically cohesive biomedical front-end with ΣΔ ADC in 0.18µm CMOS. EMBC 2015: 833-836 - [c18]Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari:
Fabrication of SU-8 based Capacitive Micromachined Ultrasonic Transducer for low frequency therapeutic applications. EMBC 2015: 1365-1368 - [c17]A. R. Aravinth Kumar, Shiv Govind Singh, Ashudeb Dutta:
Low power reconfigurable multi-mode LNA utilizing subthreshold bias and low-Q inductors. ISCAS 2015: 650-653 - [c16]Pankaj Kumar Jha, Pravanjan Patra, Jairaj Naik, Ashudeb Dutta, Amit Acharyya, Pachamuthu Rajalakshmi, Shiv Govind Singh:
A 2μW biomedical frontend with ΣΔ ADC for self-powered U-healthcare devices in 0.18μm CMOS technology. NEWCAS 2015: 1-4 - [c15]Nisha Gupta, Ashudeb Dutta, Shiv Govind Singh:
A low/high band highly linearized reconfigurable down conversion mixer in 65nm CMOS process. NORCAS 2015: 1-4 - [c14]Nagaveni Vamsi, Akash Gupta, Ashudeb Dutta, Shiv Govind Singh:
Ultra low power on-chip hybrid start-up for wireless sensor networks. NORCAS 2015: 1-4 - [c13]Nisha Gupta, A. R. Aravinth Kumar, Ashudeb Dutta, Shiv Govind Singh:
A 1.2V wide-band reconfigurable mixer for wireless application in 65nm CMOS technology. SoCC 2015: 49-52 - [c12]Nagaveni Vamsi, Pramod Kaddi, Ashudeb Dutta, Shiv Govind Singh:
A -30 dBm sensitive ultra low power RF energy harvesting front end with an efficiency of 70.1% at -22 dBm. SoCC 2015: 328-332 - 2014
- [c11]Jose Joseph, Shiv Govind Singh, Siva Rama Krishna Vanjari:
A low pull-in SU-8 based Capacitive Micromachined Ultrasonic Transducer for medical imaging applications. EMBC 2014: 1398-1401 - [c10]Pramod Kaddi, Nagaveni Vamsi, Anil Appala, Ashudeb Dutta, Shiv Govind Singh, Nagarjuna Nallam:
Efficient Dual Band RF Energy Harvesting Front End for Ultra Low Power Sensitive Passive Wearable Devices. ISED 2014: 84-88 - [c9]Pramod Kaddi, Basireddy Karunakar Reddy, Shiv Govind Singh:
Active Cooling Technique for Efficient Heat Mitigation in 3D-ICs. VLSID 2014: 495-498 - 2012
- [c8]S. Pradeep Reddy, Ashudeb Dutta, Shiv Govind Singh:
A reconfigurable aperture coupled microstrip patch antenna with beam steering capability on silicon. APCCAS 2012: 320-323 - [c7]A. R. Aravinth Kumar, Ashudeb Dutta, Shiv Govind Singh:
Noise-cancelled subthreshold UWB LNA for Wireless Sensor Network application. ICUWB 2012: 383-386 - [c6]A. R. Aravinth Kumar, Ashudeb Dutta, Shiv Govind Singh:
A 1.5-7.5GHz low power low noise amplifier (LNA) design using subthreshold technique for Wireless Sensor Network (WSN) application. ISCAS 2012: 1943-1946 - [c5]Trivikrama Rao, Ashudeb Dutta, Shiv Govind Singh, Arijit De, Bhibu Dutta Sahoo:
A Tuneable CMOS Pulse Generator for Detecting the Cracks in Concrete Walls. ISVLSI 2012: 126-130 - [c4]R. Sai Chandra Teja, Sachin Kalia, Ashudeb Dutta, Shiv Govind Singh:
Phase noise reduction of an oscillator using harmonic mixing technique. MWSCAS 2012: 194-197 - [c3]K. T. Hafeez, Ashudeb Dutta, Shiv Govind Singh:
Efficient adaptive switch design for charge pumps in micro-scale energy harvesting. VLSI-SoC 2012: 311-314
2000 – 2009
- 2009
- [c2]Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan:
Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. 3DIC 2009: 1-5 - [c1]Shiv Govind Singh, Chuan Seng Tan:
Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack. 3DIC 2009: 1-4
Coauthor Index
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