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ORCIDCedric Huyghebaert
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2020 – today
- 2021
[c7]Cheng Han Wu, Steven Brems, Didit Yudistira, Daire Cott, A. Milenin, Kevin Vandersmissen, A. Maestre, A. Centeno, Joris Van Campenhout, Cedric Huyghebaert, Marianna Pantouvaki:
Graphene electro-absorption modulators integrated at wafer-scale in a CMOS fab. VLSI Circuits 2021: 1-2
2010 – 2019
- 2019
- [c6]Chiara Alessandri, Inge Asselberghs, Peter De Heyn, Steven Brems, Cedric Huyghebaert, Joris Van Campenhout, Dries Van Thourhout, Marianna Pantouvaki:
4-Channel C-Band WDM Transmitter Based on 10 GHz Graphene-Silicon Electro-Absorption Modulators. OFC 2019: 1-3 - 2018
- [c5]Chiara Alessandri, Inge Asselberghs, Yoojin Ban, Steven Brems, Cedric Huyghebaert, Joris Van Campenhout, Dries Van Thourhout, Marianna Pantouvaki:
Broadband 20 Gbit/s Graphene-Si Electro-Absorption Modulator. ECOC 2018: 1-3 - 2017
- [c4]Yashwanth Balaji
, Quentin Smets, Cesar J. Lockhart de la Rosa, Anh Khoa Augustin Lu, Daniele Chiappe, Tarun Agarwal, Dennis Lin, Cedric Huyghebaert, Iuliana P. Radu, Dan Mocuta, Guido Groeseneken:
Tunneling transistors based on MoS2/MoTe2 Van der Waals heterostructures. ESSDERC 2017: 106-109 - [c3]Tom Schram, Quentin Smets, Benjamin Groven, M. H. Heyne, E. Kunnen, A. Thiam, Katia Devriendt, Annelies Delabie, Dennis Lin, M. Lux, Daniele Chiappe, I. Asselberghs, S. Brus, Cedric Huyghebaert, S. Sayan, A. Juncker, Matty Caymax, Iuliana P. Radu:
WS2 transistors on 300 mm wafers with BEOL compatibility. ESSDERC 2017: 212-215 - 2015
- [c2]Dries Van Thourhout, Yingtao Hu, Marianna Pantouvaki, Koen Alexander, Bart Kuyken, Steven Brems, Inge Asselberghs, Cedric Huyghebaert, Chiara Alessandri, Philippe Absil, Joris Van Campenhout:
Hybrid graphene-silicon photonics devices. ECOC 2015: 1-3
2000 – 2009
- 2009
- [c1]Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen:
3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 3DIC 2009: 1-5
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