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William E. Burdick Jr.

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1990 – 1999

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1994
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William E. Burdick Jr., Wolfgang Daum:
High-Yield Multichip Modules Based on Minimal IC Pretest. ITC 1994: 30-40
1993
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Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion:
Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. Computer 26(4): 23-29 (1993)

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