Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints.

Tue, 01 Jan 2008 00:00:00 +0100

Qiang Yu, Tadahiro Shibutani , Do-Seop Kim, Yusuke Kobayashi, Jidong Yang, Masaki Shiratori:
Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints. Microelectron. Reliab. 48(3): 431-437 (2008)